2025 Upgraded BGA Reballing Station – Universal 0.008"-0.26" Thickness & 0.08"×0.08"-2.4"×2.4" Chip Range, Tool-Free 4-Corner Stencil Fix, Lightweight Reballing Kit/BGA Adjustable Reballing Station

★★★★★ 4.7 61 reviews

$64.43
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$64.43
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Free shipping Free 30-day returns

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Management number 210127723 Release Date 2026/04/02 List Price $25.77 Model Number 210127723
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Product Brief 2025-Upgraded BGA Reballing Station – One Platform, Every Chip. Clamp anything from a 0.08*0.08 in (2*2 mm) micro-package to a 2.4*2.4 in (61*61 mm) server processor, 0.008-0.26 in (0.2-6.5 mm) thick—no adapter needed. Tool-free, four-corner auto-locks secure 3.15*3.15 in (80*80 mm) or 3.54*3.54 in (90*90 mm) stencils in seconds; swap sizes instantly and keep production moving. The quad-screw jaw micro-adjusts chip height in seconds for level, repeatable contact—delivering consistent solder-paste release and optimal ball formation every cycle. An anodized-aluminum frame weighs little yet resists corrosion, staying rock-steady on bench or field. Open the box—1* station, 4* screws, 1* hex key—and start reballing immediately. Stop hunting for fixtures—own the wider-compatible reballing station and turn every BGA repair into a fast, repeatable win.Package - 1× 2025-Upgraded BGA Reballing Station - 4× Screws - 1× Hex KeySpecification - Material: Aluminum alloy - Chip Range: 0.008-0.26 in / 0.2-6.5 mm thick, 0.08*0.08-2.4*2.4 in / 2*2-61*61 mm - Suitable Stencil: Supports 3.15"*3.15" (80*80 mm) and 3.54"*3.54" (90*90 mm) stencils - Product Size: 3.94"*3.94"*1.18" (10*10*3 cm) - Product Weight: 1.32 lbs / 600 g

  • Universal Chip Range: 2025 upgrade clamps 0.008-0.26in (0.2-6.5mm) thick, 0.08×0.08-2.4×2.4in (2×2-61×61mm) ICs—widest compatibility on one BGA reballing station
  • Tool-Free 4-Corner Stencil Fix: Auto-locks secure 3.15×3.15 in (80×80 mm) or 3.54×3.54 in (90×90 mm) stencils in seconds—no screws, no fuss
  • Stencil Compatibility: Station pairs with matching stencils for every BGA size in the range
  • Upgraded Quad-Screw Clamp: New jaw design lets you dial chip height in seconds for level, repeatable contact—delivering consistent solder-paste release and optimal ball formation every cycle
  • Lightweight Aluminum Build: Anodized alloy frame resists corrosion while staying light for bench or field use
  • Ready-to-Use Package: 1× reballing station, 4× screws, 1× hex key—assemble in moments and start reballing immediately
Brand Name YunFanSSTek
Manufacturer Follow FBA Rules
Model Number 2025
Included Components 1× 2025-Upgraded BGA Reballing Station, 4 × Screws, 1× Hex Key

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