DIYPHONE BGA Reballing Stencils Kit,11 Pcs Planting Tin Steel Mesh,Solder Tin Planting Template,Square Hole Direct Heating Planting Tin Net for iPhone 6-16 Pro Max CPU IC Chip Repair,Black

★★★★★ 4.6 76 reviews

$41.99
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$41.99
Price when purchased online
Free shipping Free 30-day returns

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Product details

Management number 218614213 Release Date 2026/05/03 List Price $16.80 Model Number 218614213
Category
  • ⛄【Planting Tin Steel Mesh 】BGA Reballing Stencils Suitable for iPhone 6/6P/6S/6SP/7/7P/8/8P/X/XS/XS MAX/XR/11/11Pro/11Pro Max/12/12mini/12 Pro/12 Pro Max/13/13mini/13 Pro Max/14/ 14 Plus/14 Pro/14 Pro Max/15/15 plus/15 Pro/15 Pro Max/16/16plus/16pro/16 Pro Max, 0.12mm thickness,which can meet your various needs.
  • ♔【BGA Reballing Stencil Material】The tin mesh solder template is made of premium stainless steel material, which is not easily damaged and good durability for long use.Crafted for durability, this stencil withstands high temperatures, ensuring reliable BGA reballing.
  • ✨【Template Mesh Directly Heat】Template Mesh Directly Heat Multi-purpose BGA Reballing Stencils Make your repair work easier.these stencils are not easy to deform when heated.
  • ⏰【Precise Positioning】Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature.
  • ✽ 【Easy To Use】The stencil has a compact appearance and is easy to carry around and use.The BGA Rework Net is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering.
UPC 686585485472
Size 2.93 inches x 3.9 inches
Style Square Hole Reballing Stencil
Brand Name DIYPHONE
Item Weight 1.6 ounces
Manufacturer DIYPHONE
Model Number Universal BGA Reballing Stencil Kit
Material Type Stainless Steel
Item Dimensions L x W 3.9"L x 2.93"W
Manufacturer Part Number HW-021-ip-11 Pcs

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4.6 out of 5
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76 ratings | 31 reviews
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